Thermal Grizzly Putty Thermal Pads (Advance)
Key Features
- Adjustable quantity
- Flexible as a gap filler
- Conforms to the surface
- Good thermal conductivity
Specification
| General | |
| Brand | Thermal Grizzly |
| Model | Putty (Advance) |
| MPN | TG-P-A-030 |
| Performance | |
| Thermal Conductivity | 8.2 W/(m·K) |
| Temperature | |
| Operating Temperature | –40 °C to +120 °C |
| Physical Specification | |
| Weight | 30 g container |
| Warranty Information | |
| Warranty | No |
Description
The Thermal Grizzly Putty (Advance / “TG Putty Advance”) is a high-quality, electrically non-conductive gap-filling compound designed mainly for GPU modding and replacing traditional thermal pads between PCBs and heatsinks, especially in graphics cards. Unlike fixed-thickness pads, this putty can flexibly fill height variations from about 0.2 mm to 3.0 mm, making it adaptable to components like VRMs, memory modules, and power delivery structures. TG Putty Advance sits in the middle of Thermal Grizzly’s product line: better thermal conductivity than the Basic version, but not as extreme as the Pro variant. It comes in a 30 g container (with spatulas) and is easy to apply using the included tools or by hand (with gloves recommended), allowing you to shape beads or spread it across surfaces. The operating temperature range is around –40 °C to +120 °C, which is suitable for most graphics card and component thermal environments. Importantly, TG Putty Advance is not suitable for direct application on CPU or GPU die surfaces (i.e. on IHS or bare silicon) — it’s meant only for the gaps between the board and cooler components. Before applying, surfaces must be thoroughly cleaned and degreased (e.g. with isopropyl alcohol or thermal pad removal wipes) to ensure optimal contact. In practice, it offers a safer and more adaptable alternative to pre-cut thermal pads in GPU cooling mods, especially where height mismatches exist, while maintaining electrical insulation and decent thermal performance for component cooling.
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