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Specification
| Chipset | Intel B365 |
| CPU SUPPORT | Socket 1151 for 9th / 8th Gen Intel® Core, Pentium and Celeron processors Maximum CPU TDP (Thermal Design Power): 95Watt * 9th / 8th Generation Intel® CoreTM Processor Family only support 300-Series. * Please refer to www.biostar.com.tw for CPU support list. |
| MEMORY | Support Dual Channel DDR4 1866/ 2133/ 2400/ 2666 MHz 2 x DDR4 DIMM Memory Slot Max. Supports up to 32GB Memory Each DIMM supports non-ECC 4/8/16GB DDR4 module ※Please refer to www.biostar.com.tw for Memory support list. |
| INTEGRATED VIDEO | By CPU model Supports DX12 Supports HDCP |
| STORAGE | 4 x SATA III Connectors (6Gb/s) 1 x M.2 (M Key) 32Gb/s Connector: Supports PCI-E (32Gb/s) & SATA III (6Gb/s) SSD, Intel® Optane Technology |
| LAN | Realtek RTL8111H – 10/100/1000Mb/s Controller |
| AUDIO CODEC | Realtek ALC887 8-Channel HD Audio Support HD Audio |
| USB | 6 x USB 3.1 Gen1 Port (4 on rear I/Os and 2 via internal header) 6 x USB 2.0 Port (2 on rear I/Os and 4 via internal header) |
| EXPANSION SLOT | 1 x PCI-E 3.0 x16 Slot 2 x PCI-E 3.0 x1 Slot |
| REAR I/O | 1 x PS/2 Mouse 1 x PS/2 Keyboard 4 x USB 3.1 Gen1 Port 2 x USB 2.0 Port 1 x HDMI Connector 1 x VGA Port 1 x LAN Port 3 x Audio Jacks |
| INTERNAL I/O | 1 x USB 3.1 Gen1 Header (each header supports 2 USB 3.1 Gen1 ports) 2 x USB 2.0 Header (each header supports 2 USB 2.0 ports) 4 x SATA III Connector (6Gb/s) 1 x Front Audio Header 1 x Front Panel Header 1 x CPU Fan Connector 1 x System Fan Connector 1 x 4-Pin Power Connector 1 x 24-Pin Power Connector 1 x Clear CMOS Header 1 x COM Port Header |
| DIMENSION | Micro ATX Form Factor Dimension: 22.8cm x 17.7 cm ( W x L ) |
| OS SUPPORT | Support Windows 10(64bit) ※Biostar reserves the right to add or remove support for any OS with or without notice. |
| ACCESSORIES | 2 x SATA Cable 1 x I/O Shield 1 x DVD Driver 1 x Quick Guide |
Description
HD Audio
Provides high quality sound with minimal loss of audio fidelity.
Hi-Fi Ground
BIOSTAR Hi-Fi Ground ( Golden Line ) is noise-blocking multi-layer PCB design to isolates analog audio signals from digital sources. Unique PCB layout is ideal for exceptional clarity and high fidelity sound.
HDMI 4K2K
The new 4K2K resolution enables high-definition image display with four times the resolution of full HD ,4K2K display is faithfully express bright, highly detailed content that fills the entire screen with lifelike images. Connectivity with PCs via a single HDMI cable for displaying 4K2K data.
DX12
DirectX 12 introduces the next version of Direct3D, the graphics API at the heart of DirectX. Direct3D is one of the most critical pieces of a game or game engine, and we’ve redesigned it to be faster and more efficient than ever before. Direct3D 12 enables richer scenes, more objects, and full utilization of modern GPU hardware.
Integrated HDMI with HDCP
Onboard HDMI connector allows full video & audio support. It has industry-leading high definition video quality.
USB 3.1 Gen 1 Type-A
Experience Fastest data transfers at 5 Gbps with USB 3.1 Gen 1–the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.1 Gen 1 transfers data 10X faster and backward compatible with previous USB 2.0 components
PCI-e M.2 32Gb/s
PCI-e M.2 32Gb/s is the latest storage interface, it delivers the highest bandwidth and lower latency. It’s 3 times faster compared with PCI-e M.2 10Gb/s.
PCI-E Gen 3.0
PCI-E 3.0 is the next evolution of the ubiquitous and general-purpose PCI Express I/O standard. At 8GT/s bit rate, the interconnect performance bandwidth is doubled over PCI-E 2.0, while preserving compatibility with software and mechanical interfaces.
SATAIII 6Gbps
STAIII 6Gbps provides a higher bandwidth to retrieve and transfer HD media. With this super speed data transfer, SATAIII allows an incredible data boost which is 2x faster than the SATA 3G.
Dual DDR4
The primary advantages of DDR4 over DDR3, include higher module density, lower voltage requirements, coupled with higher data transfer rate.
Moistureproof PCB
The popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.
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Biostar B365MHC Motherboard
6,300৳
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